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technical data sheet ???? : ssc- qp- 7- 07- 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com specification yg104-ic1 customer approval approval drawn ssc pb free
technical data sheet ???? : ssc- qp- 7- 07- 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com [ contents ] 1. description 2. absolute maximum ratings 3. electro-optical characteristics 4. characteristic diagrams 5. reliability result 6. rank 7. outline dimension 8. material 9. reel structure 10. packing 11. soldering profile 12. precaution for use
???? : ssc- qp- 7- 07- 25 (rev.0.0) technical data sheet rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com yg104-ic1 cellular phones keypad lightning information boards features applications - small size suitable for compact appliances. - surface-mounted chip led device. - pb-free and rohs complaint component. - high brightness, high efficiency - tape and reel packing. - increases the life time of battery. 1. description yg104-ic1 ? 1.6 x 0.8 x 0.4 mm ? untinted, diffused flat mold ? dominant wavelength : 572nm
technical data sheet ???? : ssc- qp- 7- 07- 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com 2. absolute maximum ratings 3. electro-optical characteristics -40 ~ 100 t stg. storage temperature v 5 v r reverse voltage mw 69 p d power dissipation -40 ~ 85 t opr. operating temperature ma 100 i fm *1 peak forward current ma 30 i f forward current unit value symbol parameter nm 577 572 567 i f =20 ? d wavelength luminous intensity* 2 ua 10 - - v r =5v i r reverse current nm - 15 - i f =20 ? ? mcd 70 50 24 i f =20 ? iv spectral bandwidth ? - 140 - i f =20 ? 2 1/2 viewing angle *3 (y) 1.9 min 2.3 max 2.1 typ v i f =20 ? v f forward voltage unit condition symbol parameter *1 i fm conditions: pulse width tw 1msec and duty ratio 1/10. *2 the luminous intensity iv is measured at the pea k of the spatial pattern which may not be aligned w ith the mechanical axis of the led package. *3 1/2 is the off-axis where the luminous intensity i s 1/2 the peak intensity. (ta=25 ) (ta=25 ) [note] all measurements were made under the standar dized environment of ssc. (tolerance : i v 10 %, d 2 nm, v f 0.1 v)
technical data sheet ???? : ssc- qp- 7- 07- 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com forward current vs. forward voltage relative luminous intensity vs. forward current ta = 25 o spectrum forward current vs. ambient temperature 4. characteristic diagrams 1.8 1.9 2.0 2.1 0 5 10 15 20 25 30 forward current [ma] forward voltage [v] 0 5 10 15 20 25 30 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 relative luminous intensity [a.u.] forward current [ma] 400 500 600 700 0.0 0.2 0.4 0.6 0.8 1.0 relative emission intensity [a.u.] wavelength [nm] -25 0 25 50 75 100 0 5 10 15 20 25 30 35 forward current [ma] ambient temperature [ ]
technical data sheet ???? : ssc- qp- 7- 07- 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com radiation diagram ta = 25 o x y 0 30 60 90 120 150 180
technical data sheet ???? : ssc- qp- 7- 07- 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com 5. reliability test 0/22 1 time 85 , 85% 24hrs reflow 3 times (max 260 10sec) thermal shock 30 cycle thermal resistance test 0/22 500 hrs 20ma, @60 ,90% operating at high temperature / high humidity 0/22 500 hrs 20ma, @85 operating at high temperature 0/22 100 cycle -40~85 shift (2hr/cycle) thermal shock test 0/22 500 hrs 20ma, @25 operating at room temperature number of damaged duration / cycle test conditions item *criterion initial value 0.1v v f > initial value * 0.5 iv ok msl : 2a (30 , 60% : 4 weeks)
technical data sheet ???? : ssc- qp- 7- 07- 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com 6. rank 570.5-573.5 1.9~2.3 48-70 06 570.5-573.5 1.9~2.3 35-48 05 570.5-573.5 1.9~2.3 24-35 04 567-570.5 1.9~2.3 48-70 03 567-570.5 1.9~2.3 35-48 02 567-570.5 1.9~2.3 24-35 01 573.5-577 1.9~2.3 48-70 09 573.5-577 1.9~2.3 35-48 08 573.5-577 1.9~2.3 24-35 07 bin i v [mcd] v f [v] w d [nm] i f = 20ma
technical data sheet ???? : ssc- qp- 7- 07- 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com anode cathode 1.1 1.2 0.4 0.18 1.6 0.8 resin 0.3 polarity mark 0.05 0.3 pcb 7. outline dimension 2.4 0.8 0.8 tolerance 0.1, unit : L [recommended solder pattern] 8. material au plated electrode epoxy gold alingap bt-resin pcb material encapsulate wire chip substrate item
technical data sheet ???? : ssc- qp- 7- 07- 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com 4.0 4.0 1.5 0.5 0.95 2.0 0.2 180 13 0.2 label 22 2 0.2 +0 - 3 60 +0.2 - 0 11.4 9 0.3 1.75 (2.75) 3.5 8.0 1.85 0.1 0.05 0.1 0.05 0.05 0.1 0.2 0.05 0.05 0.05 +0.1 - 0 0.5 0.08 (1) quantity : 4000pcs/reel (2) cumulative tolerance : cumulative tolerance/10 pitches to be 0.2mm (3) adhesion strength of cover tape : adhesion stre ngth to be 0.1-0.7n when the cover tape is turned off from the carrier tape at 1 0 angle to be the carrier tape (4) package : p/n, manufacturing data code no. and quantity to be indicated on a damp proof package 9. reel structure
technical data sheet ???? : ssc- qp- 7- 07- 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com 10. packing outer box structure c a b 7inch 245 220 142 size (mm) material : paper(sw3b(b)) type aluminum vinyl bag reel desi pak rank: part number : lot number : xxxxxxxxxx quantity : xxxx xxx seoul semiconductor co., ltd. rank: part number : lot number : xxxxxxxxxx quantity : xxxx xxx seoul semiconductor co., ltd. xxxxxx xxxxxx 1 side rank: part number : lot number : xxxxxxxxxx quantity : xxxx seoul semiconductor co., ltd. xxxxxx a b c 1 rohs 2 2 side lot number rank qty seoul semiconductor co., ltd. # # # # # # # # # # # # # # # # # # # # humidity indicator
technical data sheet ???? : ssc- qp- 7- 07- 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com 10 sec. max. soldering time condition 240 max. peak-temperature 120 sec. max. pre-heat time 120~150 pre-heat lead solder 10 sec. max. soldering time condition 260 max. peak-temperature 120 sec. max. pre-heat time 150~200 pre-heat lead free solder lead solder 2.5~5 c / sec. o o o pre-heating 120~150 c 120sec. max. 60sec. max. above 200 c o 240 c max. 10 sec. max. 2.5~5 c / sec. 260 c max. 10 sec. max. o 60sec. max. above 220 c 120sec. max. pre-heating 150~200 c 1~5 c / sec. o o o o 1~5 c / sec. lead-frame solder (1) lead solder (2) lead-free solder (3) hand soldering conditions do not exceed 3 seconds at maximum 280oc under sold ering iron. note : in case that the soldered products are reuse d in soldering process, we dont guarantee the products. 11. soldering profile
technical data sheet ???? : ssc- qp- 7- 07- 25 (rev.0.0) rev. 02 rev. 02 january 2012 january 2012 www.seoulsemicon.com www.seoulsemicon.com 12. precaution for use (1) storage leds must be stored at clean atmosphere. if the leds are stored for 3 months or more after shipment from ssc, storage in a sealed contai ner with a nitrogen atmosphere is recommended. to avoid absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. * shelf life : 12 months at < 40oc and 90%rh (2) attention after open. led is correspond to smd, when led be soldered dip, interfacial separation may affect the light transmission efficiency, causing the ligh t intensity to drop. after opened and mounted the soldering shall be quickly. * within 672 hours at factory conditions of equal t o or less than 30oc/60%rh, or stored at < 10% rh (3) repack unused products with anti-moisture packi ng, fold to close any opening and then store in a dry place. (4) in the case of change color of indicator on des iccant, components shall be dried 10-12hr at 60 5oc. (5) when the led is operating, the driving current should be determined after considering the maximum ambient temperature requirements. (6) when using multiple leds, it is recommended to connect a resistor on each led. otherwise, leds may vary due to variation in forward voltage of the leds. (7) the driving circuit must be designed to allow f orward voltage only when it is on or off. if the reverse voltage is applied to led, migr ation can be generated resulting in led damage (8) any mechanical force or excessive vibration sho uld be avoided during temperature cooling process to normal temperature after reflow. (9) rapid cooling shall be avoided. (10) led should not be placed on a flexible area on the pcb. (11) this device should not be used in any type of fluid such as water, oil, organic solvent etc. when washing is required, ipa should be used. (12) anti radioactive ray design is not considered for the products. (13) damage prevention from esd or surge. it is highly recommended to use the wrist-band or a nti electrostatic gloves when handling the leds all devices, equipments and machines mush be properly grounded (14) the appearance and specifications of the produ ct may be modified for improvement without notice.

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